DQ56 density


    DQ56 density, steel,Hot sell DQ56 density, hot rolled steel plate stock in China,China DQ56 density, hot rolled steel plate factory. Keeps more than 10,000 tons hot rolled and cold rolled DQ56 density, hot rolled steel plate in stock each month. We can meet our customer's any quantity request. Based on these stock source, our advantage industry spread into steel process like : cutting ( any size and any shape ) drilling, welding, milling, machining and steel structure. We also have a high quality logistics team who make sure the fast delivery time and shipment. Anyway, if you want to find DQ56 density, hot rolled steel plate plate/sheet supplier, DQ56 density, hot rolled steel plate plate/sheet bar manufacturer, DQ56 density, hot rolled steel plate plate/sheet bar exporter, please contact steel's sales team. We will give you the DQ56 density, hot rolled steel plate plate competitive price, DQ56 density, hot rolled steel plate plate good quality and best service from us.

Mechanical Properties

supplier of NK DQ56 density,A36,Q235B,Q345B steel plate

Home >Product list > NK DQ56 density. p235gh Boiler and Pressure Vessel Steel Plate. P235GH is a kind of material for pressure purpose. The normal delivery condition is Normalizing. P235GH is weldable fine grain steel. This material is mainly used for building

NK grade FQ56 steel supplier - steelsupplyonline

ABS DQ47/ABS DQ51/ABS DQ56/ABS . We are a manufacturer of ABS DQ47/ABS DQ51/ABS DQ56/ABS DQ63/ABS DQ70 shipbuilding steel GL LR DNV NK KR RINA Grade AQ DQ EQ FQ 43/47/51/56 this supplier. Get Price. ABS GRADE A general Strength Chemical Carbon steel plate Equivalent steel grade of ABS GRADE A DNV GL LR BV CCS NK KR RINA

2GB DDR3 SDRAM 72bit SO-DIMM

The 78.A2GCB.AF10C is a 256MX72 DDR3 SDRAM high density SO-UDIMM. This memory module consists of eighteen CMOS 256MX8 bits with 8 banks DDR3 synchronous DRAMs in BGA 27 DQS1 79 VSS 131 VDD 183 DQ56 28 DM1 80 CB6 132 VDD 184 VSS 29 VSS 81 CB2 133 DQ32 185 DQ57 30 RESET# 82 CB7 134 DQ36 186 DQS7#

ABS DH36 Plate| DH36 steel plates|DH36 Shipbuilding steel

AB/DQ56. AB/EQ56. AB/FQ56. AB/AQ63. AB/DQ63. AB/EQ63. AB/FQ63. AB/AQ70. AB/DQ70. AB/EQ70. AB/FQ70 . ABS DH 36 Plate Processing. The majority of normal processing can be performed on ABS DH 36 Plate. Triton Alloys Inc. Offers Following Processing for ABS DH 36 Plate : Cutting; Forming Drilling/ Machining;

High Density Secure Memory 8GB (1Gx64/x72) DDR4

High Density Secure Memory 8GB (1Gx64/x72) DDR4 SDRAM • Advanced miniaturization technology • Data transfer speed up to 2400 Mb/s • -55 to +125°C operating temperature • Including Decoupling and Terminations • Manufactured in a DMEA-trusted US facility

GL grade DQ56 steel for Offshore Structures

steel grade BV EQ70 density China steel specification RMRS grade EQ70 shipbuilding steel sheet for Offshore Structures; GL DH32 shipbuilding material steel sheet for Offshore Structures; BV FQ56 shipbuilding steel sheet for Offshore Structures AB/DQ56.

168-PIN SDRAM UDIMM SYNCHRONOUS

part number module density configuration system bus speed mt8lsdt1664ag-13e_ 128mb 16 meg x 64 133 mhz mt8lsdt1664ay-13e_ 128mb 16 meg x 64 133 mhz dq56 dq57 dq58 dq59 dq60 dq61 dq62 dq63 dqmb7 dqm cs# u6 dq dq dq dq dq dq dq dq dq48 dq49 dq50 dq51 dq52 dq53 dq54 dq55 dqmb6 dqm cs# u4 dq dq dq dq dq dq dq dq dq40 dq41 dq42 dq43 dq44 dq45 dq46

BV grade DQ56 steel for Offshore Structures

AB/EQ56.ABS Material Data Sheet Physical Properties Metric English Comments Density 1.04 g/cc 0.0376 lb/in³ Grade Count = 3 Melt Flow 18 - 23. S355J2G3 Steel Plate for Ship Building and Ocean DQ56 shipbuilding steel plate, DQ56 ocean steel

DDR3 SDRAM SODIMM - micron

Density Configuration Module Bandwidth Memory Clock/ Data Rate Clock Cycles (CL-tRCD-tRP) 25 VSS 77 NC 129 DQ32 181 DQ56 26 VSS 78 A15 130 DQ36 182 DQ61 27 DQS1# 79 BA2 131 DQ33 183 DQ57 28 DM1 80 A14 132 DQ37 184 VSS 29 DQS1 81 VDD 133 VSS 185 VSS 30 RESET# 82 VDD 134 VSS 186 DQS7#

Electronics, Inc. Tel: 408-732-5000 Fax: 408-732-5055

75 VDD 76 VDD 181 DQ56 182 DQ61 77 NC 78 A151 183 DQ57 184 VSS 79 BA2 80 A141 185 VSS 186 DQS7 81 VDD 82 VDD 187 DM7 188 DQS7 83 A12/ BC 84 A11 189 VSS 190 VSS This address might be connected to NC balls of the DRAMs (depending on density); either way they will be connected to the termination resistor. ATP AW24M64F8BLK0MW

DDR SDRAM UDIMM 184-Pin, 512MB, 1GB, 2GB x64,

Density Configuration Module Bandwidth Memory Clock/ Data Rate Clock Cycles 14 DQS1 37 A4 60 DQ35 83 DQ56 106 DQ13 129 DM3 152 VSS 175 DQ61 15 VDDQ38 VDD 61 DQ40 84 DQ57 107 DM1 130 A3 153 DQ44 176 VSS 512MB, 1GB, 2GB (x64, DR) 184-Pin DDR SDRAM UDIMM

SDRAM RDIMM 168-Pin, 128MB, 256MB, x72 Data Sheet

Density Configuration Memory Clock/ Data Rate Clock Cycles (CL-tRCD-tRP) MT9LSDT1672G-13E__3 128MB 16 Meg x 72 7.5ns/133 MT/s 2-2-2 DQ56 DQ57 DQ58 DQ59 DQ60 DQ61 DQ62 DQ63 RDQMB7 DQM CS# DQ48 DQ49 DQ50 DQ51 DQ52 DQ53

EBJ20UF8BDU0-GN-F datasheet - Specifications: Memory

Density: 2GB Organization 256M words × 64 bits, 1 rank Mounting 8 pieces of 2G bits DDR3 SDRAM sealed in FBGA Package: 240-pin socket type dual in line memory module VSS /DQS4 DQS4 VSS DQ34 DQ35 VSS DQ40 DQ41 VSS /DQS5 DQS5 VSS DQ42 DQ43 VSS DQ48 DQ49 VSS /DQS6 DQS6 VSS DQ50 DQ51 VSS DQ56 DQ57 VSS /DQS7 DQS7 VSS DQ58 DQ59 VSS SA0 SCL SA2

M2U25664DS88C3G-6K datasheet - Specifications: Memory

pin vss dq11 cke0 vddq dq17 dqs2 vss dq18 a7 vddq dq19 front vref dq0 vss dqs0 dq2 vdd dq3 nc vss dq9 dqs1 vddq ck1 pin back vss dq4 dq5 vddq dq6 dq7 vss nc vddq dq13 dm1/dqs10 vdd dq15 cke1 vddq dq20 a12 vss a11 dm2/dqs11 vdd a8 dq23 pin key dq32 vddq dqs4 dq34 vss dq35 dq40 front a5 dq24 vss dqs3 a4 vdd dq27 a2 vss a1 nc vdd a0 nc vss nc ba1

3.3V DRAM Modules HYM64Vx005GCD(L)-60 144 pin SO

8mb , 16mb, 32mb & 64mb density hym64vx005gcd(l)-60 49 dq13 50 dq45 121 dq24 122 dq56 51 dq14 52 dq46 123 dq25 124 dq57 53 dq15 54 dq47 125 dq26 126 dq58 55 vss 56 vss 127 dq27 128 dq59 57 nc 58 nc 129 vcc 130 vcc 59 nc 60 nc 131 dq28 132 dq60 61 du 62 du 133 dq29 134 dq61

2GB 256Mx72 DDR3 SDRAM ECC UNBUFFERED SO

2GB 256Mx72 DDR3 SDRAM ECC UNBUFFERED SO-UDIMM 204-PIN 2 FUNCTIONAL BLOCK DIAGRAM The block diagram is based on Printed Circuit Board design. For different memory density or configuration, please refer to “MEMORY CONFIGURATION TRUTH TABLE” DQS DQ56 to DQ63 DM DQS# ZQ DQS DQS# VDDSPD DQ0 to DQ7 DQ48 to DQ55 DQS1# DQS# Vss Vss CKE0: SDRAMs

1GB 128Mx64 DDR SDRAM LOW PROFILE NON-ECC

low profile non-ecc unbuffered dimm 184-pin 1 37 a4 83 dq56 129 dm3 175 dq61 38 vdd 84 dq57 130 a3 176 vss 39 dq26 85 vdd 131 dq30 177 dm7 40 dq27 86 dqs7 132 vss 178 dq62 1gb 128mx64 ddr sdram low profile non-ecc unbuffered dimm 184-pin 2 functional block diagram

DDR3 Unbuffered DIMM Module - Super Talent

DDR3 Unbuffered DIMM Module 4GB based on 2Gbit component TFBGA with Pb-Free Part number Density Module Organization Component composition Component PKG Module 28 DQ19 148 Vss 67 VREFCA 187 NC/EVENT 108 DQ56 228 DQ61 29 Vss 149 DQ28 68

(PDF) Water-soluble substituted chitosan derivatives as

charge density will be dependent on their environment. Ethidium bromide displacement assay. Ethidium bromide (EtBr) (4 m l, 1 mg/ml) charged DQ56 polymer molecules in solution due to the.

Buy Open air Liquid Pipelines-BBN STEEL sale steel

BV grade DQ56 shipbuilding steel sheet factory. astm st35 8 carbon steel sheet price for kg. Contact Us. Tel: +86-371-86151827 Fax: +86-371-86011881 low-density foam pigs for both liquid removal in wet-gas pipelines and paraffin removal in oil and multiphase pipelines

42crmo 4140 scm440 Alloy Steel-BBN STEEL sale steel

ABS grade DQ56 shipbuilding steel sheet dealer. SS400 S235jr hot rolled mild steel plate sheet. China Manufacturer Steel Round Pipe. 430 Stainless Steel Coils. density high tensile AH36. high speed steel cutting machine blade. RMRS grade FQ56 shipbuilding steel sheet stock.

78FBGA with Lead-Free & Halogen-Free (RoHS compliant)

Part Number Density Organization Component Composition Number of Rank Height M471B5773CHS-YF8/H9/K0 2GB 256Mx64 256Mx8(K4B2G0846C-HY##)*8 1 30mm 43 VSS 44 SS 111 VDD 112 DD 181 DQ56 182 DQ61 45 DQS246 DM2113 WE 114 S 0 183 DQ57 184 VSS 47 DQS2 48 VSS 115 CAS 116 ODT0 185 VSS 186 DQS7

Data sheet HYS64T[128/256]020EDL-[25F/2.5/3S](-)C2

in organization and density, intended for mounting into 204-pin connector sockets. The memory array is designed with 4Gbit Double-Data- -Three ( DDR3) Synchronous RAMs. ecoupling 21 DQ8 61 VSS 101 CK0 141 DQ34 181 DQ56 22 DQ12 62 /DQS3 102 CK1 142 DQ39 182 DQ61 23 DQ9 63 DM3 103 /CK0 143 DQ35 183 DQ57

32Mx64 DDR SDRAM - Richardson RFPD

DENSITY COMPARISONS FUNCTIONAL DE SCRIP TION Read and write accesses to the DDR SDRAM are burst ori ent ed; accesses start at a selected location and continue for DQ56 DQ57 DQ60 DQ62 VSS VSS DQ30 DQ28 DQ25 DQ24 CLK1 CKE1 VCC VCC CS2# CAS2# DQ39 DQ38 DQ35 DQ33 VCC DQ0 DQ2 DQ4 DQ5 DQML0 WE0# RAS0# VSS VSS CKE3 CLK3 DQMH3 DQ58 DQ59

CUSTOMER: APPROVAL SHEET - Advantech

Part Number Bandwidth Speed Grade Max Frequency CAS Latency Density Organization Component Composition Number of Rank 78.C1GET.ATF0C. 12.8GB/sec 1600Mbps 800MHz CL11 8GB . 1024Mx64 512Mx8*16EA DQ56 to DQ63 DQS6 /DQS6 DM6 DQ48 to DQ55 DQS5 /DQS5 DM5 DQ40 to DQ47 DQS4 /DQS4 DM4 DQ32 to DQ39 DQS /DQS DM DQ0 to DQ7 DQS /DQS DM DQ0 to DQ7 DQS

4096MB DDR3 SDRAM ECC SO-DIMM - Mouser

4096MB DDR3 – SDRAM ECC SO-DIMM 204 Pin ECC SO-UDIMM Module density 4096MB with 18 dies and 2 rank 183 DQ56 31 DQ10 81 CB2 133 DQ32 185 DQ57 33 DQ11 83 CB3 135 DQ33 187 V SS 35 V SS 85 V DD 137 V SS 189 DM7 37 DQ16 87 CKE0 139 DQS4# 191 DQ58 39 DQ17 89 CKE1 141 DQS4 193 DQ59

288pin Registered DIMM based on 8Gb C-die -

14 dq12 158 vss 53 vss 197 dqs8_t 91 odt1 235 nc,c2 130 dq56 274 vss 15 VSS 159 DQ13 54 CB6 198 VSS 92 VDD 236 VDD 131 VSS 275 DQ57 16 DQ8 160 VSS 55 VSS 199 CB7 93 C0,CS2 _n ,NC 237 NC,CS3 _c ,C1 132

HB56SW464DB6B datasheet & applicatoin notes - Datasheet

Text: HB56SW464DB-6B /7B 4,194,304-word x 64-bit High Density Dynamic RAM Module HITACHI Description , Front side Pin No. 19 21 23 25 27 29 31 , DQ56 DQ57 DQ58 DQ59 NC HITACHI 457 HB56SW464DB-6B /7B Pin Description Pin name AO to A11

DDR3 Registered/ECC DIMM Module - Super Talent

240-Pin DDR3- Reg/ECC-DIMM DDR3 SDRAM supertalent/oem Products and Specifications discussed he rein are subject to change without notice

UDOO X86 SINGLE BOARD

RAM ICs DENSITY B0 --> 1Gb ICs B1 --> 2Gb ICs B2 --> 4Gb ICs B3 --> 8Gb ICs SINGLE/DUAL CHANNEL RAM C0 --> DUAL CHANNEL C1 --> SINGLE CHANNEL UDOO X86 SINGLE BOARD Components with CFG indications have to be mounted only on specific board's configurations (see table in this same page)

China steel plate supplier DNV grade FQ70 tensile

AB/DQ56 shipbuilding steel plate is suitable for offshore drilling platforms, shipping engineering and shipbuilding projects. The shipbuilding steel plate is ABS grade DQ56. A283C density,China factory A283C density,low price A283C density,China A283C density supplier,Hot sell all kinds of steel in China with best price.

256MB DDR SDRAM SoDIMM - Arrow Electronics

Module density 256MB with 4 dies and 1 rank Standard Grade (T ) 0°C to 70°C E-Grade (TA) 0°C to 85°C I DQ56 DQ57 DQ58 DQ59 DQ61 DQ60 DQ62 DQ63 DQS7 DM7 DQS7 I/O 0 I/O 1 I/O 2 I/O 3 I/O 5 I/O 4 I/O 6 I/O 7 LDM LDQS DQ48 DQ49 DQ50 DQ51 DQ53 DQ52 DQ54 DQ55 DQS6 DM6 DQS6 S0 LDQS I/O 8 I/O 9 I/O 10

China steel plate supplier KR DQ47 data sheetsteel grade

APPROVAL SHEET APPROVED NO. : 90005-T0006 ISSUE DATE : JULY-16-2014 MODULE PART NO. : 77.G1737.440 Apacer 77.G1737.440 is 64M x 64 Double Data Rate SDRAM high density memory modules based on first generation of 512Mb DDR SDRAM DQ47 DQ48 DQ49 DQ50 DQ52 DQ54 DQ55 DQ56 DQ57 DQ58 DQ59 DM D6 DQ60 DQ61 DQ62 DQ63 DM1 DQ32 DQ33 DQ34 DQ35 I/O 0

1.35V DDR3L SDRAM SODIMM - Markit

25 VSS 77 NC 129 DQ32 181 DQ56 26 VSS 78 NF/A151 130 DQ36 182 DQ61 27 DQS1# 79 BA2 131 DQ33 183 DQ57 28 DM1 80 NF/A142 132 DQ37 184 VSS See the Pin Assignments table for density-specific ad-dressing information. BAx Input Bank address inputs: Define the device bank to which an ACTIVE, READ, WRITE, or

SUS304A - Special Alloy - Tool amp; Die Steel - Find Steel

Welcome to the yellow page of Chinese steel plants,and the listing of national steel grades.

DDR3L SODIMM - rosch-computer.de

DRAM Parameters by device density RTT_Nom Setting Parameter 4Gb Units tRFC REF command ACT or REF command time 260 ns tREFI 45 /DQS2 113 /WE 181 DQ56 46 DM2 114 /S0 182 DQ61 47 DQS2 115 /CAS 183 DQ57 48 VSS 116 ODT0 184 VSS

DDR3 SODIMM Industry Speed Data Rate MT/s tAA

Part Number Density Speed DIMM Organization Number of DRAM Number of rank ECC M3S0-4GSJDCL6 4GB PC3-6400 512Mx64 16 2 N : Rev 1.0 DQ56 DQ57 DQ58 DQ63 DQ60 DQ62 DQ61 DQ59 D7 I/ O 0 I/ O 1 I/ O 6 I/ O 5 I/ O 4 I/ O 3 I/ O 2 I/ O 7 DM DQ32 DQ33 DQ34 DQ39 DQ36 DQ38 DQ37 DQ35 D4 I/ O 0 I/ O 1 I/ O 6 I/ O 5 I/ O 4 I/ O 3 I/ O 2

16MEGX64 (PC133) - futureelectronics

is optimized for high density and large capacity in a compact size. 16MEGX64 (PC133) 16,777,216 words x 64Bit Synchronous Dynamic RAM Memory Module (Unbuffered DIMM) Rev: 0.0 06/10 DQ56 DQ60 DQ61 DQ63 DQ62 DQ59 DQ25 DQ26 DQ24 DQ28 DQ29 DQ31 DQ30 DQ27 DQ10 DQ12 DQ13 DQ15 DQ14 DQ11 UDQM DQ5 DQ7 DQ6 DQ3 DQ1 DQ2 DQ0 DQ4 DQ3 DQ6 DQ7 DQ5 DQ4 LDQM

PC100 SDRAM MODULE SD3264-16X4D-84VS4 -

PC100 SDRAM MODULE SD3264-16X4D-84VS4 1 Revision: A 07/11/00 GENERAL DESCRIPTION The Advantage SD3264-16X4D-84VS4 is a 32MX64 Synchronous Dynamic RAM high density memory module. The Advantage SD3264-16X4D-84VS4 consists of thirty-two CMOS DQ56 DQ57 DQ58 DQ59 VDD DQ60 DQ61 DQ62 DQ63 VSS CLK3 NC **SA0 **SA1 **SA2 VDD PIN CONFIGURATIONS

PC100 SDRAM MODULE SD3272-16X4S-81VRS4 -

Synchronous Dynamic RAM high density memory module. The DQ56 DQ57 DQ58 DQ59 VDD DQ60 DQ61 DQ62 DQ63 VSS CLK3 NC **SA0 **SA1 **SA2 VDD PIN CONFIGURATIONS (Front/Back) A0 ~ A11 BA0 ~ BA1 DQ0~DQ63 CB0 ~ 7 PC100 SDRAM MODULE SD3272-16X4S-81VRS4 ~ A.

V436632Y24VD 256MB 144-PIN UNBUFFERED SDRAM

V436632Y24VD 256MB 144-PIN UNBUFFERED SDRAM SODIMM 32M X 64 3.3VOLT V436632Y24VD Rev.1.2 June 2007 Features where increased memory density and fast access times are required. Part Number Speed DQ56 DQ25 DQ57 DQ26 DQ58 DQ27 DQ59 VDD VDD DQ28 DQ60 DQ29 DQ61 DQ30 DQ62 DQ31 DQ63 VSS VSS SDA SCL VDD VDD

TI SN74ALVC16835 COMPONENT SPECIFICATION

13 DQ9 41 VCC 69 DQ24 97 DQ41 125 CK1 153 DQ56 14 DQ10 42 CK0 70 DQ25 98 DQ42 126 A12 154 DQ57 15 DQ11 43 VSS 71 DQ26 99 DQ43 127 VSS 155 DQ58 The bit density of the buffer/register should be considered when selecting a device for a DIMM design. For example, 29 signals

Intel Stratix 10 MX FPGA Development Kit User Guide

The integrated 3D stack High-Bandwidth DRAM Memory (HBM2) is a "near memory" implementation where the high-density stacked DRAM is integrated very close to the FPGA in the same package.

DDR3 ECCDIMM Spec - silicon-power

DM is an input mask signal for writ e data. Input data is masked when DM is sampled HIGH, along with the input data, during a write access. DM is sampled on both edges

DDR3 SODIMM Industry Speed Data Rate MT/s tAA

Part Number Density Speed DIMM Organization Number of DRAM Number of rank ECC M3S0-4GSJDCL6 4GB PC3-6400 512Mx64 16 2 N : Rev 1.0 DQ56 DQ57 DQ58 DQ63 DQ60 DQ62 DQ61 DQ59 D7 I/ O 0 I/ O 1 I/ O 6 I/ O 5 I/ O 4 I/ O 3 I/ O 2 I/ O 7 DM DQ32 DQ33 DQ34 DQ39 DQ36 DQ38 DQ37 DQ35 D4 I/ O 0 I/ O 1 I/ O 6 I/ O 5 I/ O 4 I/ O 3 I/ O 2

DDR3L SODIMM Spec R16 - Silicon Power

Module Density & Configuration Bandwidth Data Rate Timing Operator (tCL-tRCD-tRP) Voltage 25 VSS 77 NC 129 DQ32 181 DQ56 26 VSS 78 NC 130 DQ36 182 DQ61 27 DQS1# 79 BA2 131 DQ33 183 DQ57 28 DM1 80 NC/A14 132 DQ37 184 VSS DDR3L SODIMM Product Specification 6 Rev. 1.5 May. 2015 Pin Description

HMA851S6CJR6N-UH/VK Serial Presence Detect

4 SDRAM Density and Banks 2BG/4BK/8Gb 45 5 SDRAM Addressing 16/10 21 6 Primary SDRAM Package Type Flipchip SDP 00 76 Connector to SDRAM Bit Mapping DQ56-59 0B 77 Connector to SDRAM Bit Mapping DQ60-63 35 78~116 Reserved Blank 00 117 Fine offset for tCCD_Lmin, same bank group 5.0ns 005ns

DDR3L SDRAM Unbuffered SODIMMs Based on 4Gb B

DDR3L SDRAM Unbuffered SODIMMs Based on 4Gb B-die HMT451S6BFR8A HMT41GS6BFR8A Part Number Density Organization Component Composition # of ranks HMT451S6BFR8A-G7/H9/PB/RD 4GB 512Mx64 512Mx8(H5TC4G83BFR)*8 1 25 VSS 26 VSS 77 NC 78 A152 129 DQ32 130 DQ36 181 DQ56 182 DQ61

V916765K24QC 128M x 64 HIGH PERFORMANCE

128M x 64 HIGH PERFORMANCE UNBUFFERED DDR2 SDRAM MODULE Features • 240-pin, unbuffered dual in-line memory module systems where increased memory density and fast access times are required. DDR2-533 PC2-4200 (E4) DDR2-667 PC2-5300 (F5) DQ56 DQ57 DQ58 DQ59 DQ60 DQ61 DQ62 DQ63 D7 DQ DQ DQ DQ DQ DQ DQ DQ D15

288pin Load Reduced DIMM based on 8Gb C-die

14 dq12 158 vss 53 vss 197 dqs8_t 91 odt1 235 nc,c2 130 dq56 274 vss 15 vss 159 dq13 54 cb6 198 vss 92 vdd 236 vdd 131 vss 275 dq57 16 dq8 160 vss 55 vss 199 cb7 93 c0,cs2_n,nc 237 nc,cs3_c,c1 132 tdqs16_t, dqs16_t 276 vss 17 vss 161 dq9 56 cb2 200 vss 94 vss 238 sa2 133 tdqs16_c, dqs16_c 277 dqs7_c 18 tdqs10_t,

4096MB DDR3 SDRAM ECC SO-DIMM - Startseite

module density 183 dq56 31 dq10 81 cb2 133 dq32 185 dq57 33 dq11 83 cb3 135 dq33 187 v ss 35 v ss 85 v dd 137 v ss 189 dm7 37 dq16 87 cke0 139 dqs4# 191 dq58 39 dq17 89 cke1 141 dqs4 193 dq59 41 v ss 91 ba2 143 v ss 195 v

Serial Presence Detect - hynix

4 SDRAM Density and Banks 4BG/4BK/8Gb 85 4BG/4BK/8Gb 85 4BG/4BK/8Gb 85 5 SDRAM Addressing 17/10 29 17/10 29 17/10 29 76 Connector to SDRAM Bit Mapping DQ56-59 16 DQ56-59 16 DQ56-59 16 77 Connector to SDRAM Bit Mapping DQ60-63 03 DQ60-63 03 DQ60-63 03 78~116 Reserved Blank 00 Blank 00 Blank 00

SDRAM DDR3256M, 512MX 64 UDIMM - spectek

48 NC 108 DQ56 168 RESET# 228 DQ61 49 NC 109 DQ57 169 CKE1 229 Vss 50 CKE0 110 Vss 170 Vdd 230 DM7 51 VDD 111 DQS7# 171 NC 231 NC See the Pin Assignments Table for density-specific addressing information. BAx Input Bank address inputs: Define the device bank to which an ACTIVE, READ, WRITE,

M471B5673EH1-CF8 - elcodis

This address might be connected to NC balls of the DRAMs (depending on density); either way they will be connected to the termination resistor. SAMSUNG ELECTRONICS CO., Ltd. reserves the right to change products and specifications without notice.

260pin Unbuffered SODIMM based on 8Gb C-die

Part Number 2) Density Organization Component Composition 1) Number of Rank Height M471A5244CB0-CPB/RC/TD 4GB 512Mx64 512Mx16(K4A8G165WC-BC##)*4 1 30mm 3 DQ5 4 DQ4 81 VSS 82 VSS 159 VDD 160 VDD 237 DQ56 238 VSS 5 VSS 6 VSS 83 DQ26 84 DQ27 161 ODT1 162 C0,CS2_n,N C 239 VSS 240 DQS7_c 7 DQ1 8 DQ0 85 VSS 86 VSS 163 VDD 164 VREFCA 241

SAMSUNG - BDTIC

The Samsung M372F080(8)3DJ(T)0-C is a 8Mx72bits Dynamic RAM high density memory module. The Samsung M372F080(8)3DJ(T)0-C consists of nine CMOS 8Mx8bits DRAMs in SOJ/TSOP-II 400mil packages and two 16 bits driver IC in TSSOP package mounted on a 168-pin glass-epoxy substrate. A 0.1 or 0.22uF decoupling capacitor is

168-Pin DIMM-Memory - ELHVB

For certain x72 and x80 DIMM configurations it may be necessary to mix different density/organization SDRAMs in order to achieve the required DIMM organization. A x72 DIMM may require a mix of x16/x4 or x32/x8 SDRAMs, a x80 DIMM may require a mix of x32/x16 SDRAMs. For example, consider a 4Mx72 DIMM using 4Mx16 and 4Mx4 SDRAMs.

32Mx64 Synchronous DRAM - Asaiki

density comparisons discrete approach (mm) w332m64v-xbx s a v i n g s area 4 x 265mm2 = 1,060mm2 625mm2 41% 25 25 w332m64v-xbx 22.3 11.9 11.9 11.9 11.9 54 tsop 54 tsop 54 tsop 54 tsop. dq56 dq57 dq60 dq62 vss dq0 dq2 dq4 dq5 dqml0 we0# ras0# vss vss cke3 clk3 dqmh3 dq58 dq59 dq61 dq63 dq14 dq12 dq10 dq8 vcc vcc vcc vcc vcc vcc vcc vcc dq55

Electronics, Inc. - bressner.de

High Density: 4GB (512M x 64) DIMM Rank: 2 Ranks Cycle Time: 1.25ns (800MHz) CAS Latency: 11 Power supply: 1.5V ± 0.075V Internal self calibration through ZQ 108 DQ56 228 DQ61 KEY 109 DQ57 229 VSS 49 NC 169 CKE1 110 VSS 230 DM7 50 CKE0 170 VDD 111 DQS7 231 NC 51 VDD 171 NC 112 DQS7 232 VSS

US5995424A - Synchronous memory test system - Google

Memory test controller 116 is identified by part number ispLSI 1048E-70LQ, and is a high-density programmable logic device which is available from Lattice Semiconductor Corp., 5555 Northeast Moore Court, Hillsboro, Oreg. 97124.

­mÅ ÂÝÕYÖ - jnu.ac.kr

J. of Aquaculture Vol. 19(4) : 247-253, 2006 247 Jour nal of Aquaculture ©Korean Aquaculture Society ß-1,3 , , 1, 2, Okorie Eme Okorie 1, , 1*

M470L3224DT0-CB0 datasheet(3/12 Pages) SAMSUNG |

M470L3224DT0Rev. 0.1 Jan. 2002200pin DDR SDRAM SODIMMGENERAL DESCRIPTIONPIN DESCRIPTION*These pins are not used in this module.Pin NameFunctionA0 ~ A12 datasheet search, datasheets, Datasheet search site for Electronic Components and Semiconductors, integrated circuits, diodes and other semiconductors.

B1A0 datasheet & applicatoin notes - Datasheet Archive

340100101B DCME37SNMB1A0N 3401-001 Standard Density D-Sub Connector ESA/ESCC Socket 37 Position Solder Right Angle Through Hole Bag - Bulk (Alt: 340100101B DCME37SNMB1A0N) Distributors: Part: Package: Text: CS CKE Add,CTL DQM DQ0~3 VSS D15 D7 DQ56~59 10 D16 DQ24~27 10 PCLK5 B1A0 ~B1A12 , B0A0,B0A1,B0A2 B1A0 ,B1A1,B1A2 B0RAS, B0CAS, B0WE

DDR4 SDRAM UDIMM - docs-apac.rs-online

Density Configuration Module Bandwidth Memory Clock/ Data Rate Clock Cycles (CL-tRCD-tRP) 22 VSS 58 RESET_n 94 VSS 130 DQ56 166 DQ15 202 VSS 238 SA2 274 VSS 23 DQ10 59 VDD 95 DQ36 131 VSS 167 VSS 203 CKE1 239 VSS 275 DQ57 24 VSS 60 CKE0 96 VSS 132 DM7_n/ DBI7_n, NC 168 DQ11 204 VDD 240 DQ37 276 VSS


Product Description:

shipbuilding steel stock


ABS,LR shipbuilding steel


steel for shipbuilding and oil platform:

Henan BEBON Iron & Steel Co., Ltd , is professional in exporting the steel for shipbuilding and oil platform. Our product have the following several feature
1.The size of steel plates we can supply is 3mm-180mm * 1250mm-4000mm * 3000mm-18000mm
2.The main standard our steel is according to ASTM A131,API.
3.The main classification society we cooperate are: ABS ,GL, LR, BV, NK,DNV,KR,RINA.
4.Productive technology: HR,CR,TMCP,N,Q&T,IMPACT TEST,Z15,Z25,Z35.
5.Hard stamp about the brand of manufacturer, Heat No.,Batch No., steel grade, steel size, and the brand of Classification Society.
6.Blasting according to SA2.5 standard, and the shop primed on the steel, coating thickness is 15-35 micrometer.


Get In Touch24/7 Support

We receive enquiries in English, Español (Spanish). Our professional team will reply to you within one business day. Please feel free to contact us!

Leave a Message Email: sales4@bebonchina.com